● Lithography equipment: Through lithography technology, micro-structure patterns of the pressure sensor, such as the sensitive membrane and electrodes, are fabricated on the silicon wafer.

● Etching equipment: Chemical or physical methods are used to etch the silicon wafer to form precise pressure-sensitive structures, such as etching out the thin-film cavity used to sense pressure changes.

● Coating equipment: Such as a magnetron sputtering coater, various functional films, such as insulating films and conductive films, are coated on the surface of the sensor to improve the performance and stability of the sensor.

● Encapsulation equipment: The chip is encapsulated with the housing. Common types include ceramic encapsulation and metal encapsulation, etc., to ensure that the internal structure of the sensor is not affected by the external environment.