● Silicon wafer processing equipment: Including lithography, etching and other equipment, which is used to manufacture high-precision pressure-sensitive elements on the silicon wafer.

● Welding equipment: Such as laser welding machines, resistance welding machines, etc., which are used to connect various components of the sensor to ensure the reliability of the electrical connection.

● Encapsulation equipment: Using injection molding machines or potting machines, etc., the sensitive elements and circuits of the sensor are encapsulated in a specific housing, playing a role in protection and insulation.

● Testing equipment: There are pressure calibrators, electrical performance testers, etc., which are used to conduct performance testing and calibration of the sensor to ensure product quality.